Online (automated) microwave plasma system
Microelectronics and Semiconductor Manufacturing
Pre-packaging treatment: enhances the bonding strength of the chip and the packagingnaterial;
"Wafer dleaning:Remove photoresistresidue, organic contaminants and particles activate and roughen wafer surface, mprove wafer weting properties;
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Project |
Solid state source version |
Magnetron version |
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Output power |
250W×8 |
1.25kW×2 |
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Output frequency |
2400MHz-2500MHz Can adjustable |
2450MHz±25MHz |
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Frequency error |
±50ppm |
1-2% |
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Microwave leaks |
≤2mW/cm2 |
≤2mW/cm2 |
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Cooling method |
Water cooling (1/8 pagoda joint, water flow rate ≥ 2.5L/min, when the inlet water temperature is lower than the ambient temperature, the temperature difference between the two is ≤ 10 °C) |
Water cooling (DN15 pagoda joint, water flow ≥ 2.5L/min, when the inlet water temperature is less than the ambient temperature, the temperature difference between the two is ≤10°C) |
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Process gases |
Ar、O2、H2、CF4 etc |
Ar、O2、H2、CF4etc |
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Plasma treatment area |
0.19m2 |
0.15m2 |






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