Online (automated) microwave plasma system

Online (automated) microwave plasma system

Online (automated) microwave plasma system

Microelectronics and Semiconductor Manufacturing
Pre-packaging treatment: enhances the bonding strength of the chip and the packagingnaterial;
"Wafer dleaning:Remove photoresistresidue, organic contaminants and particles activate and roughen wafer surface, mprove wafer weting properties;

Project

Solid state source version

Magnetron version

Output power

250W×8

1.25kW×2

Output frequency

2400MHz-2500MHz Can adjustable

2450MHz±25MHz

Frequency error

±50ppm

1-2%

Microwave leaks

≤2mW/cm2

≤2mW/cm2

Cooling method

Water cooling (1/8 pagoda joint, water flow rate ≥ 2.5L/min, when the inlet water temperature is lower than the ambient temperature, the temperature difference between the two is ≤ 10 °C)

Water cooling (DN15 pagoda joint, water flow ≥ 2.5L/min, when the inlet water temperature is less than the ambient temperature, the temperature difference between the two is ≤10°C)

Process gases

Ar、O2、H2、CF4 etc

Ar、O2、H2、CF4etc

Plasma treatment area

0.19m2

0.15m2

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